SEEQC Signs MoU with Taiwan Quantum Industry Technology Promotion Office to Build Cryo-Chip Supply Chain
SEEQC Signs MoU with Taiwan Quantum Industry Technology Promotion Office to Build Cryo-Chip Supply Chain
Digital quantum computing platform developer SEEQC has signed a Memorandum of Understanding (MoU) with Taiwan’s Quantum Industry Technology Promotion Office (QITPO)—an agency established under the Ministry of Economic Affairs (MOEA)—to formalize a cross-border quantum technology and supply-chain partnership. Signed at SEMICON Taiwan 2026 in Taipei, the agreement creates a structured framework for technology transfer, joint QPU/ASIC development, testing, and commercialization across Taiwan’s advanced semiconductor foundry ecosystem.
[ SEALSQ & Taiwan QITPO Partnership Framework ]Strategic Institutional PartnerHardware & Supply Chain FocusCore Technical Mandate• Taiwan Quantum Industry Technology Promotion Office (QITPO)• Sub-10 Kelvin Superconducting Chip Fabrication• Single Flux Quantum (SFQ) Digital Qubit Control Integration• Ministry of Economic Affairs (MOEA)• Cryogenic CMOS (cryo-CMOS) ASIC Interfaces• Millikelvin Co-Design Platform Validation• Taiwan Academic & Industrial Foundry Network• Room-Temperature Control Electronics & Packaging• Scalable Fault-Tolerant System Architecture Commercialization
Leveraging Advanced Foundries for Sub-Kelvin Electronics
Scaling superconducting quantum processors requires moving room-temperature control racks directly onto cryogenic chips operating at millikelvin temperatures. SEEQC’s architecture integrates qubit control and readout directly into sub-Kelvin layers using digital Single Flux Quantum (SFQ) circuits and specialized cryogenic CMOS. The MoU directly targets Taiwan’s semiconductor infrastructure to manufacture and package these hybrid chips:
Cryo-CMOS & SFQ Manufacturing: Integrates SEEQC’s U.S.-developed IP with Taiwanese foundry capabilities specializing in low-temperature silicon, including IC processes qualified to operate reliably down to 4 Kelvin (-269°C).
Advanced Packaging & Interconnects: Leverages Taiwan’s 3D heterogenous integration, high-density substrate, and advanced packaging infrastructure to interconnect superconducting quantum processing units (QPUs) with digital SFQ control chips.
Supply Chain Formalization: Expands upon SEEQC’s existing regional relationships in room-temperature control hardware, establishing a standardized supply chain for commercial multi-qubit systems.
Strategic Context and Regional Ecosystem Integration
The agreement strengthens ties established under previous foundry initiatives connecting U.S. quantum architecture design with Taiwanese chip manufacturing. Executed following the MOEA’s formal creation of the QITPO in April 2026, the partnership aligns with Taiwan’s national initiative to establish a domestic quantum hardware supply chain and position its semiconductor industry as an international manufacturing hub for cryogenic quantum components.
Review the official press release via Business Wire here, and examine our previous coverage of SEEQC’s US-Taiwan Quantum Ecosystem Initiatives here.
September 3, 2026
Mohamed Abdel-Kareem2026-09-03T08:36:39-07:00
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